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| CALIFORNIA MICRO DEVICES PACGTL HIGH PERFORMANCE GTL TERMINATION NETWORK FOR SOCKET 370 PROCESSORS Features 24 terminations in a single package 5 chip solution for all 119 GTL terminations High speed termination network Center ground pin placement reduces ground bounce and eases board layout Very low cross-talk Saves board space and reduces assembly cost Applications High Performance Servers High Performance Desk Top Systems Intel Celeron and Pentium CPUs Application Information High speed microprocessors demand unique, high speed bus termination. The PACGTL Termination Network provides 24 terminations per package and meets the requirements for high speed terminations. The termination resistor values are 56 or 120 ohms each. Five devices provide the necessary terminations for the 32-bit address bus, 64-bit data bus, and the control of status signals. Potential board layout solutions are included in this datasheet. This termination network provides high performance, high reliability, and low cost through manufacturing efficiency. The termination resistor elements are fabricated using state-of-the-art thin film manufacturing. This integrated solution is siliconbased and has the same reliability characteristics of todays microprocessor products. The thin film resistors have very high stability over temperature, over applied voltage, and over life. In addition, the QSOP (SSOP) industry standard packaging is easy to handle in manufacturing and yields high reliability similar to other semiconductor components. STANDARD VALUES R e s i s to r ( R ) 56 or 120 Ohms Ab so l u te To l e ra n c e ( R ) +5% T CR +150ppm Op e ra ti n g Te mp e ra tu re R a n g e 0C to 70C M a x P a c ka g e P o we r R a t i n g ( 7 0 C ) 1.00W M i n i mu m I n s u l a t i o n R e s i s t a n c e 10,000Meg W Cr o s s -ta l k * 4% STANDARD CONFIGURATION R(W) 56 120 Code 560 121 Power Rating / Resistor 100 mW 40 mW * PAC560GTL or PAC121GTL used as a terminator. Signal on a single victim line when all other lines are driven synchronously and simultaneously. STANDARD PART ORDE RING INFORMATION Package Ordering Part Number Style Part Marking QSOP QSOP PAC560GTL PAC121GTL Pins 28 28 When placing an order please specify desired shipping: Tubes or Tape & Reel. All trademarks are the property of their respective holders. (c)2000 California Micro Devices Corp. All rights reserved. P/Active(R) is a registered trademark and PAC is a trademark of California Micro Devices. 2/00 C0290498D 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES RECOMMENDED LAYOUT FOR SOCKET 370 (OPTION A) FOR CELERON AND MENDOCINO CPUs PACGTL 11-mil track pitch, single layer Note: This option requires 1 metal layer in board routing for all 119 GTL termination lines. (c) 2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 2/00 CALIFORNIA MICRO DEVICES PACGTL RECOMMENDED LAYOUT FOR SOCKET 370 (OPTION B) FOR CELERON AND MENDOCINO CPUs Note: This option requires 2 metal layers in board routing for all 119 GTL termination lines. Please note that the second layer only uses 6 short traces, minimizing potencial interference with other traces, and also minimizing the number of vias. (c)2000 California Micro Devices Corp. All rights reserved. 2/00 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 3 |
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